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STTH2R06 数据表(PDF) 4 Page - STMicroelectronics |
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STTH2R06 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 9 page ![]() STTH2R06 4/9 Figure 7: Relative variations of dynamic parameters versus junction temperature Figure 8: Transient peak forward voltage versus dIF/dt (typical values) Figure 9: Forward recovery time versus dIF/dt (typical values) Figure 10: Junction capacitance versus reverse voltage applied (typical values) Figure 11: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35µm) (SMA/SMB/SMC) Figure 12: Thermal resistance versus lead length (DO-41) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 IRM QRR trr T (°C) j I=I Reference: T =125°C F F(AV) j V =400V R 0 5 10 15 20 25 30 0 50 100 150 200 250 V (V) FP dI /dt(A/µs) F I=I T =125°C F F(AV) j 0 50 100 150 200 250 300 0 50 100 150 200 250 t (ns) fr dI /dt(A/µs) F I=I T =125°C F F(AV) j V =1.1 x V max. FR F 1 10 100 1 10 100 1000 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j R (°C/W) th(j-a) 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMA SMB SMB S (cm²) CU 0 20 40 60 80 100 120 5 1015 2025 R (°C/W) th L (mm) lead Rth(j-a) Rth(j-l) |
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