MECHANICAL DATA

MXBG003A NOVEMBER 2001 – REVISED MAY 2002

1

POST OFFICE BOX 655303

YEA (R–XBGA–N6)

DIE–SIZE BALL GRID ARRAY

4203167–3/C 04/2002

0,85

0,95

0,50 MAX

0,35 MAX

1,45

1,35

A

B

A

M C

0,05

0,05

0,05

0,10

0,15

C

SEATING PLANE

C

C

M

0,15

0,19

0,25

PIN A1 INDEX AREA

1

6X

2

A

B

B

C

0,50

0,50

1,00

NOTES: A.

All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. NanoStar package configuration.

D. Package complies to JEDEC MO–211 variation EA.

E. This package is tin–lead (SnPb). Refer to the 6 YZA package (drawing 4204151) for lead–free.