Multilayer Ceramic Capacitors

Approval Sheet

Page 5 of 9

ASC_ Low Profile_(TT)_009Q_AS

Dec. 2018

9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS

No.

Item

Test Condition

Requirements

Mechanical

---

* No remarkable defect.

* Dimensions to conform to individual specification sheet.

Cap

≤10µF, 1.0±0.2Vrms, 1kHz±10%

Cap>10µF, 0.5±0.2Vrms, 120Hz±20%**

** Test condition: 0.5±0.2Vrms，1KHz±10%

TT18X≧475(10V) , TT15X series

*Before initial measurement (Class II only): To apply de-aging

at 150°C for 1hr then set for 24±2 hrs at room temp .

* Shall not exceed the limits given in the detailed spec.

(Dissipation

Factor)

X7R/X5R:

Rated vol.

D.F.

100V

≤5%

50V, 25V, 16V, 10V

≤10%

6.3V

≤15%

Y5V:

Rated vol.

D.F.

50V

≤7%

25V

≤9%

16V/10V

≤12.5%

Strength

* To apply voltage: 250% rated voltage.

* Duration: 1 to 5 sec.

* Charge and discharge current less than 50mA.

* No evidence of damage or flash over during test.

Resistance

* To apply rated voltage for max. 120 sec.

≥10G or RxC≥100 -F whichever is smaller.

Coefficient

With no electrical load.

T.C.

Operating Temp

X7R

-55~125°C at 25°C

X5R

-55~85°C at 25°C

Y5V

-25~85°C at 20°C

*Before initial measurement (Class II only):

To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at

room temp.

01005

0201

Cap

≤0.01µF: 0.5V

Cap<0.1µF:1V

Cap>0.01µF: 0.2V

0.1µF*

≤Cap<1µF: 0.2V

Cap

≥1µF: 0.1V

*0201X104/16V: 0.5V

0402

0603

Cap<1µF: 1V

Cap

≤1µF: 1V

Cap=1µF: 0.5V

1µF<Cap

≤4.7µF: 0.5V

1µF<Cap<10µF: 0.2V

Cap>4.7µF: 0.2V

Cap

≥10µF: 0.1V

0805

1206/1210

Cap<10µF: 1V

Cap

≤10µF: 1V

Cap=10µF: 0.5V

10µF<Cap

≤100µF: 0.5V

Cap>10µF: 0.2V

Cap>100µF: 0.2V

T.C.

Capacitance Change

X7R

Within ±15%

X5R

Within ±15%

Y5V

Within +30%/-80%

Strength of

Termination

* Pressurizing force：5N (

≤0603) and 10N (>0603)

* Test time: 10±1 sec.

* No remarkable damage or removal of the terminations.

Resistance

* Vibration frequency: 10~55 Hz/min.

* Total amplitude: 1.5mm

* Test time: 6 hrs. (Two hrs each in three mutually

perpendicular directions.)

* Before initial measurement (Class II only):

To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at

room temp.

* Cap./DF(Q) Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

* No remarkable damage.

* Cap change and Q/D.F.: To meet initial spec.

* Solder temperature: 235±5°C

* Dipping time: 2±0.5 sec.

95% min. coverage of all metalized area.

* The middle part of substrate shall be pressurized by means

of the pressurizing rod at a rate of about 1 mm per second until

the deflection becomes 1 mm and then the pressure shall be

maintained for 5±1 sec.

* Before initial measurement (Class II only):

To apply de-aging at 150°C for 1hr then set for 24± 2 hrs at

room temp.

* Measurement to be made after keeping at room temp. for

24±2 hrs.

* No remarkable damage.

* Cap change：

X7R/X5R: within ±12.5%

Y5V: within ±30%

(This capacitance change means the change of capacitance under

specified flexure of substrate from the capacitance measured before

the test.)

Soldering Heat

* Solder temperature: 260±5°C

* Dipping time: 10±1 sec

* Preheating: 120 to 150°C for 1 minute before imme rse the

capacitor in a eutectic solder.

*Before initial measurement (Class II only): To apply de-aging

at 150°C for 1hr then set for 24±2 hrs at room temp .

*Cap. / DF(Q) / I.R. Measurement to be made after de-aging at

150°C for 1hr then set for 24±2 hrs at room temp.

* No remarkable damage.

* Cap change:

X7R/X5R: within ±7.5%

Y5V: within ±20%

* Q/D.F., I.R. and dielectric strength: To meet initial requirements.

* 25% max. leaching on each edge.