SFECV10M7KA00-R0 datasheet(42/57 Pages) MURATA

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Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested

to approve our product specification or to transact the approval sheet for product specification, before your ordering.

P61E7.pdf 01.10.17

Chip Type Discriminators CDACV Series Notice

s Notice (soldering and mounting)

1. Standard Reflow Soldering Condition

(1) Reflow

The component cannot be withstand washing.

2. Wash

Lead terminal is directly contacted with the tip of

soldering iron of 280

±5˚C for 3.0±0.5 seconds.

(2) Soldering Iron

Gradual

Cooling

240

230

150

Time (sec.)

5sec.

s Notice (handling)

1. The component may be damaged if excess mechanical

stress is applied to it mounted on the printed circuit

board.

2. Design layout of components on the PC board to

minimize the stress imposed on the warp or flexure of the

board.

3. After installing chips, if solder is excessively applied to

the circuit board, mechanical stress will cause destruction

resistance characteristics to lower. To prevent this, be

extremely careful in determining shape and dimension

before designing the circuit board diagram.

4. When the positioning claws and pick up nozzle are worn,

the load is applied to the chip while positioning is

concentrated to one positioning accuracy, etc. Careful

checking and maintenance are necessary to prevent

unexpected trouble.

5. When correcting chips with a soldering iron, the tip of the

soldering iron should not directly touch the chip

component. Depending on the soldering conditions, the

effective area of terminations may be reduced. the use of

solder containing Ag should be done to prevent the

electrode erosion.

6. Do not clean or wash the component as it is not

hermetically sealed.

7. In case of covering discriminator with over coat,

conditions such as material of resin, cure temperature,

and so on should be evaluated well.

8. Accurate test circuit values are required to measure

electrical characteristics.

It may be a cause of mis-correlation if there is any

deviation, especially stray capacitance, from the test

circuit in the specification.

[Component direction]

[Component layout close to board]

Put the

component

lateral to the

direction in

which stress

acts.

Susceptibility to

stress is in the order

of : A>C>B

Slit

Perforation

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