MAX4940 datasheet(2/18 Pages) MAXIM

2 / 18 page

Dual/Quad, Unipolar/Bipolar,

High-Voltage Digital Pulsers

2 ______________________________________________________________________________________

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(Voltages referenced to GND.)

VDD Logic Supply Voltage ......................................-0.3V to +6V

VCC Output Driver Positive Supply Voltage..........-0.3V to +15V

VEE Output Driver Negative Supply Voltage ........-15V to +0.3V

VPP_ High-Positive Supply Voltage ........-0.3V to (VNN_ + 220V)

VNN_ Low-Negative Supply Voltage ...................-220V to +0.3V

VPP1 - VNN1, VPP2 - VNN2 Supply Voltage .........-0.6V to +250V

INP_, INN_, CLP_, EN Logic Input........... -0.3V to (VDD + 0.3V)

CGN_ Voltage ......................... (-0.3V + VNN_) to (+15V + VNN_)

CGP_ Voltage............................(+0.3V + VPP_) to (-15V + VPP_)

CDP_, CDN_ Voltage................................................-0.3V to VCC

Continuous Power Dissipation (TA = +70NC)

56-Pin TQFN (derate 47.6mW/NC above +70NC).......3809mW

Thermal Resistance (Note 1)

JA................................................................................21NC/W

JC .................................................................................1NC/W

Operating Temperature Range............................. 0NC to +70NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

ELECTRICAL CHARACTERISTICS

(VDD = +3V, VCC = +12V, VEE = -12V, VPP_ = +100V, VNN_ = -100V, TA = TMIN to TMAX, unless otherwise noted. Typical values are

at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY (VDD, VCC, VEE, VPP_, VNN_)

Logic Supply Voltage

VDD

2.37

Positive Drive Supply Voltage

VCC

4.75

12.6

Negative Drive Supply Voltage

VEE

1.05 x

(-VCC)

-VCC

0.95 x

(-VCC)

High-Side Supply Voltage

VPP1

+200

Low-Side Supply Voltage

VNN1

-200

High-Side Supply Voltage

VPP2

VPP1

Low-Side Supply Voltage

VNN2

VNN1

VPP_ - VNN_ Supply Voltage

+200

SUPPLY CURRENT (for single channel)

VDD Supply Current

IDD

VINN_/VINP_/VCLP_ = 0 or VDD, VEN = 0

VEN = VDD, VCLP_ = 0 or VDD, VINN_ =

VINP_, f = 5MHz, one channel switching

100

200

VCC Supply Current

ICC_

VEN = 0 (static)

VEN = VDD (static)

VEN = VDD, VCLP_ = 0 or VDD, VINN_ =

VINP_, f = 5MHz, VCC = +12V, VDD = +3V,

one channel switching

VEN = VDD, VCLP_ = 0 or VDD, VINN_ =

VINP_, f = 5MHz, VCC = +5V, VDD = +3V,

one channel switching

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