CSR09B565KB datasheet(82/84 Pages) KEMET

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temperature. Capacitance, DF, and DCL are measured

at each test temperature except that DCL is not

measured at -55°C.

When measurements are made at the various steps, the

electrical limits for each temperature shall not exceed

the following limits.

Step 1, +25°C,

DCL as indicated in original limit;

capacitance within tolerance speci-

fied; DF as indicated in original limit

shown in Part Number Tables.

Step 2,

-55°C, Capacitance within ±10% of initial

value; ESR, DF within limit shown in

Part Number Tables.

Step 3, +25°C, DCL as indicated in original limit;

capacitance within ±5% of initial

value; ESR, DF within limit shown in

Part Number Tables.

Step 4, +85°C, DCL shall not exceed 10 times original

DCL limit at 25°C. Capacitance shall

be within ±10% of the initial value. DF

shall be within 125% of limits shown in

Part Number Tables. ESR shall be

within limits shown in Part Number

Tables.

Step 5, +125°C, DCL shall not exceed 12.5 times the

original limit at 25°C. Capacitance

shall be within ±12% of initial value.

DF shall be within 150% of limits

shown in Part Number Tables. ESR

shall be within limits shown in Part

Number Tables.

Step 6, +25°C, DCL as indicated in original limit;

capacitance within ±5% of initial

value; ESR, DF as indicated in origi-

nal limit shown in Part Number

Tables.

Note: M39003 specifies

∆'s and limits by individual slash

sheet.

• DAMP HEAT, STEADY STATE: Meets requirements of

IEC Publication 384-15, method IEC 68-2-3. Climatic

category 55/125/56.

19. MOUNTING

All encapsulated Series fall into two general classes.

The first is provided with leads extending from opposite

ends of the body, generally along the principle axis of the

body (“axial leads”). The second is provided with parallel

leads extending from one side or face of the body (“radial

leads”). With either type, mounting points are normally

provided by the leads themselves.

Axial leads may be used for point-to-point wiring, but

usually, the wires are bent at 90° from the capacitor axis

for insertion through printed circuit (PC) boards. Axial

capacitors supplied on reels for machine insertion will

withstand the mechanical stresses of bending and insert-

ing by all popular machines known to KEMET at this time.

Most KEMET axial Series may be supplied on reels to feed

such machines. Radial leads are intended to plug directly

into holes of PC boards. Auto-machines will insert com-

batible radial capacitor designs, and most KEMET capac-

itors may be supplied in appropriate reeled forms (ARIS).

With either axial or radial types, attention should be

paid to treatment of the capacitors during mounting and

afterward under service conditions. Difficulty during

mounting usually arises from lead damage or from over-

heating. Hand soldering technique or, more often, wave-

solder machines cause the overheating. The internal cath-

ode connection on most Series is made between solder

and a silver-pigmented paint. If too much heat is applied,

this solder may remelt and degrade the silver-solder inter-

face or cause a direct short-circuit.

KEMET’s hermetically-sealed series has an internal

space into which molten cathode solder may run, depriv-

ing the cathode connection and possibly flowing across

the terminals to short-circuit the capacitor from the inside.

It is also possible to remelt the solder which bonds the rim

of the glass-metal seal, causing loss of hermeticity and

possibly a short-circuit. Finally, solder at the exit point of

the positive wire may be remelted with similar effect. This

solder is a high-temperature alloy, however, and it is much

less likely to be melted. (Re-dipping of lead wires is prac-

ticed by some users, introducing another hazard of remelt-

ing this solder).

Plastic-encased Series have only one site of solder,

the internal cathode connection. The rate of heat transfer

through the plastic is lower than through the metal can of

hermetic Series, but conduction along the negative lead-

wire to remelt this solder is very similar. There is little inter-

nal void within plastic cases, so remelted solder tends to

remain in its original location and solidify when heat is

removed. Short-circuiting is very unlikely, but reliability of

the internal connection may be compromised by leaching

of silver from the paint into the molten solder. The latter

effect degrades the cathode connection in hermetic parts

as well.

All encased capacitors will pass the Resistance to

Soldering Heat Test of MIL-STD-202, Method 210,

Condition B. This test dips each leadwire into molten sol-

der at +260° C for 10 seconds while the capacitor body is

held vertically above the solder. KEMET capacitors will

pass this test when the depth of immersion brings the

capacitor body (or closest external solder joint, if it is clos-

er as in some hermetic Series) to a minimum distance of

0.100 inches from the solder surface. This demonstration

of resistance to solder heat is in accordance with what is

believed to be the industry standard. More severe treat-

ment must be considered reflective of an improper solder-

ing process.

Shown in Figure 13 is a recommended solder wave

profile for both axial and radial leaded solid tantalum

capacitors.

KEMET

APPLICATION NOTES FOR TANTALUM CAPACITORS

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606 (864) 963-6300

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