SM6HT

4/6

Figure 7: Variation of thermal impedance

junction to ambient versus pulse duration

(Printed circuit board FR4 with recommended

pad layout)

Figure 8: Thermal resistance junction to

ambient versus copper surface under each

lead (printed circuit board FR4, e(Cu)=35µm)

Figure 9: Variation of leakage current versus

junction temperature (typical values)

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

1E-1

1E+0

1E+1

1E+2

Z

(°C/W)

th(j-a)

t (ms)

p

012345

40

50

60

70

80

90

100

R

(°C/W)

th(j-a)

S(cm²)

25

50

75

100

125

150

175

1E-1

4E-2

1E+0

2E+0

I (µA)

R

T (°C)

j