THS3201D datasheet(19/29 Pages) TI

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THS3201

SLOS416A − JUNE 2003 − REVISED JANUARY 2004

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PowerPAD DESIGN CONSIDERATIONS

The THS3201 is available in a thermally-enhanced

PowerPAD family of packages. These packages are

constructed using a downset leadframe upon which the die

is mounted [see Figure 61(a) and Figure 61(b)]. This

arrangement results in the lead frame being exposed as a

thermal pad on the underside of the package [see

Figure 61(c)]. Because this thermal pad has direct thermal

contact with the die, excellent thermal performance can be

achieved by providing a good thermal path away from the

thermal pad.

The PowerPAD package allows for both assembly and

thermal management in one manufacturing operation.

During the surface-mount solder operation (when the

leads are being soldered), the thermal pad can also be

soldered to a copper area underneath the package.

Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either

a ground plane or other heat dissipating device.

The PowerPAD package represents a breakthrough in

combining the small area and ease of assembly of surface

mount with the, heretofore, awkward mechanical methods

of heatsinking.

DIE

Side View (a)

DIE

End View (b)

Thermal

Pad

Bottom View (c)

Figure 61. Views of Thermally Enhanced Package

Although there are many ways to properly heatsink the

PowerPAD package, the following steps illustrate the

recommended approach.

0.060

0.040

0.075

0.025

0.205

0.010

vias

Pin 1

Top View

0.017

0.035

0.094

0.030

0.013

Figure 62. DGN PowerPAD PCB Etch and Via

Pattern

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