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DSC1104 数据表(PDF) 4 Page - Microchip Technology |
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DSC1104 数据表(HTML) 4 Page - Microchip Technology |
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4 / 28 page ![]() DSC1104/24 DS20005870A-page 4 2017 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Operating Temperature Range TA –20 — +70 °C Ordering Option E –40 — +85 °C Ordering Option I –40 — +105 °C Ordering Option L Junction Temperature TJ — — +150 °C — Storage Temperature Range TS –55 — +150 °C — Soldering Temperature — — — +260 °C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. |
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