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J SERIES™ 2835 LED

REFLOW SOLDERING CHARACTERISTICS

In testing, Cree Venture has found J Series 2835 LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a

general guideline, Cree Venture recommends that users follow the recommended soldering profile provided by the manufacturer of the

solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.

Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.

Profile Feature

Lead-Free Solder

Temperature Min. (Ts

150 °C

Temperature Max. (Ts

200 °C

Time (ts) from Ts

60‑120 seconds

Ramp‑Up Rate (T

3 °C/second

Liquidus Temperature (T

217 °C

Time (t

60‑150 seconds

Peak Package Body Temperature (Tp)

260 °C max.

Time (tp) Within 5 °C of the Specified Classification Temperature (Tc)

30 seconds max.

Ramp‑Down Rate (T

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

Note: All temperatures refer to the topside of the package, measured on the package body surface.

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

L

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

Ts

max

Ts

min