Custom MMIC

300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294

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Mechanical Information

ver 1.1 0717

CMD177

6-14 GHz Fundamental Mixer

Die Outline (all dimensions in microns)

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 100 microns thick

5. All bond pads are 100 x 100 microns square

1

2

3

108.00

570.50

1160.00

525.00

790.00