CC3235MODASM2MONR datasheet(85/100 Pages) TI1

85 / 100 page

CC3235MODAS, CC3235MODASF

www.ti.com

SWRS233 – OCTOBER 2019

Submit Documentation Feedback

Product Folder Links: CC3235MODAS CC3235MODASF

Environmental Requirements and SMT Specifications

(1)

For details, refer to the solder paste manufacturer's recommendation.

8.6

Soldering and Reflow Condition

•

Heating method: Conventional convection or IR convection

•

Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering

portion or equivalent method

•

Solder paste composition: SAC305

•

Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 8-1)

•

Temperature profile: Reflow soldering will be done according to the temperature profile (see

Figure 8-1)

•

Peak temperature: 260°C

Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component

(at Solder Joint)

Table 8-1. Temperature Profile

Profile Elements

Convection or IR(1)

Peak temperature range

235 to 240°C typical (260°C maximum)

Pre-heat / soaking (150 to 200°C)

60 to 120 seconds

Time above melting point

60 to 90 seconds

Time with 5°C to peak

30 seconds maximum

Ramp up

< 3°C / second

Ramp down

< -6°C / second

NOTE

TI does not recommend the use of conformal coating or similar material on the SimpleLink™

module. This coating can lead to localized stress on the solder connections inside the

module and impact the module reliability. Use caution during the module assembly process

to the final PCB to avoid the presence of foreign material inside the module.

CC3235MODASM2MONR 数据表(PDF) 85 Page - Texas Instruments

CC3235MODASM2MONR 数据表(HTML) 85 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100

数据表下载