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OPA207IDBVT 数据表(PDF) 4 Page - Texas Instruments |
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OPA207IDBVT 数据表(HTML) 4 Page - Texas Instruments |
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4 / 39 page ![]() 4 OPA207 SBOS826D – DECEMBER 2017 – REVISED OCTOBER 2019 www.ti.com Product Folder Links: OPA207 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input current must be limited to 10 mA. (3) Short circuit to ground, one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, Vs = (V+) – (V–) 36 V Input voltage - Common-mode(2) (V–) -0.7 (V+) +0.7 V Input voltage - Differential –1 1 V Output short-circuit(3) Continuous Operating temperature –55 125 °C Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, Vs = (V+) – (V–) Single Supply 4.5 30 36 V Dual Supply ±2.25 ±15 ±18 V Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package ThermalMetrics application report. 6.4 Thermal Information THERMAL METRIC(1) OPA207 UNIT DGK (VSSOP) D (SOIC) DBV (SOT-23) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 176.7 121.5 166.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 63.9 64.3 116.9 °C/W RθJB Junction-to-board thermal resistance 99.4 65.0 63.2 °C/W ψJT Junction-to-top characterization parameter 8.8 18.2 45 °C/W ψJB Junction-to-board characterization parameter 97.6 64.3 62.9 °C/W |
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