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ES2DP 数据表(PDF) 3 Page - Nexperia B.V. All rights reserved

部件名 ES2DP
功能描述  200 V, 2 A hyperfast PN-rectifier
PDF  14 Pages
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制造商  NEXPERIA [Nexperia B.V. All rights reserved]
网页  https://www.nexperia.com/
标志 NEXPERIA - Nexperia B.V. All rights reserved

ES2DP 数据表(HTML) 3 Page - Nexperia B.V. All rights reserved

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Nexperia
ES2DP
200 V, 2 A hyperfast PN-rectifier
ES2DP
All information provided in this document is subject to legal disclaimers.
© Nexperia B.V. 2017. All rights reserved
Product data sheet
25 August 2017
3 / 14
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
200
V
VR
reverse voltage
-
200
V
VRMS
RMS voltage
Tj = 25 °C
-
140
V
IF
forward current
δ = 1 ; Tsp ≤ 125 °C
-
2.8
A
IF(AV)
average forward current δ = 0.5 ; f = 20 kHz; square wave; Tsp
130 °C
-
2
A
IFSM
non-repetitive peak
forward current
tp = 8.3 ms; Tj(init) = 25 °C; single half sine
wave (applied at rated load condition)
-
46
A
[1]
-
835
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
1.316
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
-
-
150
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[2]
-
-
95
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[3]
-
-
10
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Soldering point of cathode tab.



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