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PESDXUSB30 数据表(PDF) 3 Page - Nexperia B.V. All rights reserved |
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PESDXUSB30 数据表(HTML) 3 Page - Nexperia B.V. All rights reserved |
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3 / 19 page ![]() PESDXUSB30_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2016. All rights reserved. Product data sheet Rev. 2 — 26 April 2016 3 of 19 Nexperia PESDxUSB30 series ESD protection for differential data lines 3. Ordering information 4. Marking 5. Limiting values Table 3. Ordering information Type number Package Name Description PESD1USB30 WLCSP5 wafer level chip-size package; 5 bumps (2-1-2) PESD2USB30 WLCSP10 wafer level chip-size package; 10 bumps (4-2-4) PESD3USB30 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6) Table 4. Marking codes Type number Marking code PESD1USB30 PD1S PESD2USB30 PD2S PESD3USB30 PD3S Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VI input voltage -0.5 5 V VESD electrostatic discharge voltage IEC 61000-4-2, level 4; all input pins to ground contact discharge -15 15 kV air discharge -15 15 kV IEC 61000-4-2, level 4; all output pins to ground contact discharge -2 2 kV air discharge -2 2 kV IPPM rated peak-pulse current tp =8/20 s-8 8 A Tstg storage temperature -40 +125 °C Tamb ambient temperature -40 +85 °C |
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