PEMIXCSP_FAM

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 27 January 2012

12 of 16

NXP Semiconductors

PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

The device is capable of withstanding at least three reflows of this profile.

Fig 14. Pb-free solder reflow profile

Table 12.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

230

-

260

C

time 1

soak time

60

-

180

s

time 2

time during T

 250 C --30

s

time 3

time during T

 230 C10

-

50

s

time 4

time during T > 217

C 30

-

150

s

time 5

-

-

540

s

dT/dt

rate of change of temperature cooling rate

-

-

6

C/s

pre-heat

2.5

-

4.0

C/s

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250

230

217

T

(

°C)

cooling rate

preheat

t (s)