PEMIXCSP_FAM

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 27 January 2012

11 of 16

NXP Semiconductors

PEMIxCSP family

4-, 6- and 8-channel passive filter network with ESD protection

10. Design and assembly recommendations

10.1 PCB design guidelines

It is recommended, for optimum performance, to use a Non-Solder Mask

Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled

micro-vias connecting the ground pads to a buried ground-plane layer. This results in the

lowest possible ground inductance and provides the best high frequency and

ESD performance. Refer to Table 10 for the recommended Printed-Circuit Board (PCB)

design parameters.

10.2 PCB assembly guidelines for Pb-free soldering

Table 10.

Recommended PCB design parameters

Parameter

Value or specification

PCB pad diameter

250

m

Micro-via diameter

100

m (0.004 inch)

Solder mask aperture diameter

325

m

Copper thickness

20

m to 40 m

Copper finish

AuNi

PCB material

FR4

Table 11.

Assembly recommendations

Parameter

Value or specification

Solder screen aperture diameter

290

m

Solder screen thickness

100

m (0.004 inch)

Solder paste: Pb-free

SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)

Solder to flux ratio

50 : 50

Solder reflow profile

see Figure 14