1

FB1

2

GND

3

EN1

4

GND

5

EN2

6

IN1

7

FB2

8

OUT1

9

IN2

10

OUT2

Not to scale

Thermal

Pad

3

TLV751

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SBVS385 – DECEMBER 2019

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5 Pin Configuration and Functions

DSQ Package

10-Pin Adjustable WSON

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

DSQ

EN1

3

Input

EN2

5

Input

FB1

1

—

This pin is used as an input to the control loop error amplifier and is used to set the

output voltage of the LDO.

FB2

7

—

This pin is used as an input to the control loop error amplifier and is used to set the

output voltage of the LDO.

GND

2, 4

—

Ground pin

IN1

6

Input

Input pin. For best transient response and to minimize input impedance, use the

recommended value or larger ceramic capacitor from IN to ground; see the

Recommended Operating Conditions table and the Input and Output Capacitor Selection

section. Place the input capacitor as close to the output of the device as possible.

IN2

9

Input

Input pin. For best transient response and to minimize input impedance, use the

recommended value or larger ceramic capacitor from IN to ground; see the

Recommended Operating Conditions table and the Input and Output Capacitor Selection

section. Place the input capacitor as close to the output of the device as possible.

OUT1

8

Output

Regulated output voltage pin. A capacitor is required from OUT to ground for stability.

For best transient response, use the nominal recommended value or larger ceramic

capacitor from OUT to ground; see the Recommended Operating Conditions table and

the Input and Output Capacitor Selection section. Place the output capacitor as close to

output of the device as possible.

OUT2

10

Output

Regulated output voltage pin. A capacitor is required from OUT to ground for stability.

For best transient response, use the nominal recommended value or larger ceramic

capacitor from OUT to ground; see the Recommended Operating Conditions table and

the Input and Output Capacitor Selection section. Place the output capacitor as close to

output of the device as possible.

Thermal pad

Pad

—

Connect the thermal pad to a large area GND plane for improved thermal performance.