SPREAD SPECTRUM

Ordering Code

Spread Percentage

Spread Type

A

±0.25%

Center-Spread

B

±0.5%

Center-Spread

C

±1.0%

Center-Spread

D

±1.5%

Center-Spread

E

±2.0%

Center-Spread

F

±2.5%

Center-Spread

G

–0.25%

Down-Spread

H

–0.5%

Down-Spread

I

–1.0%

Down-Spread

J

–1.5%

Down-Spread

K

–2.0%

Down-Spread

L

–3.0%

Down-Spread

M

Custom

Center-Spread or Down-Spread

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature

–40

—

+150

°C

—

Storage Ambient Temperature Range

–55

—

+150

°C

—

Soldering Temperature

—

+260

—

°C

40 sec. max.

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

imum allowable power dissipation will cause the device operating junction temperature to exceed the max-

imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.

 2019 Microchip Technology Inc.

DS20006189A-page 5

DSA63XX