RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

1.65 BSC

MIN

E

MAX

Space Between Contacts (X4)

Contact Pad Length (X6)

G1

Y0.80

Microchip Technology Drawing C04-3202A

NOM

4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]

SILK SCREEN

12

4

X

Contact Width (X4)

Space Between Contacts (X3)

G2

0.45

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

X

Y

G2

C

E

(CH)

C

Contact Spacing

1.25

0.70

0.95

Contact 1 Index Chamfer

CH

0.13 X 45° REF

G1

DSA63XX

DS20006189A-page 20

 2019 Microchip Technology Inc.