RECOMMENDED LAND PATTERN

Dimension Limits

Units

X2

Contact Width (X2)

Contact Pitch

MILLIMETERS

1.55 BSC

MIN

E

MAX

Space Between Contacts (X4)

Contact Pad Length (X6)

G1

Y0.70

Microchip Technology Drawing C04-3200A

NOM

4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]

SILK SCREEN

12

4

X1

Contact Width (X4)

Space Between Contacts (X3)

G2

0.25

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

X1

Y

G2

G1

E

(CH)

C

Contact Spacing

0.95

0.40

0.50

1.05

Contact 1 Index Chamfer

CH

0.13 X 45° REF

C

 2019 Microchip Technology Inc.

DS20006189A-page 17

DSA63XX