Microchip Technology Drawing C04-1199A Sheet 2 of 2

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Number of Terminals

Overall Height

Overall Width

Terminal Length

Substrate Thickness (with Terminals)

Terminal Pitch

Standoff

Units

Dimension Limits

A1

A

b2

A3

e

L

E

N

1.20 BSC

0.20 REF

0.325

0.30

0.79

0.00

0.35

0.375

0.84

0.02

1.20 BSC

MILLIMETERS

MIN

NOM

4

0.425

0.40

0.89

0.05

MAX

CH

0.125

--

Terminal 1 Index Chamfer

Overall Length

D

1.60 BSC

Terminal Width

b1

0.25

0.30

0.35

Terminal Width

Terminal Pitch

e1

0.75 BSC

 2019 Microchip Technology Inc.

DS20006189A-page 13

DSA63XX