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BQ28Z610-R1

SLUSE07 – JANUARY 2020

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Copyright © 2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VC2, PBI

–0.3

30

V

PACK

–0.3

30

V

TS

–0.3

V

SRP, SRN

–0.3

0.3

V

VC2

VC1 – 0.3

VC1 + 8.5 or

VSS + 30

V

VC1

VSS – 0.3

VSS + 8.5 or

VSS + 30

V

Communication Interface

SDA, SCL

–0.3

6

V

CHG, DSG

–0.3

32

V

±50

mA

–40

110

°C

±300

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±500

7.3 Recommended Operating Conditions

to 26 V (unless otherwise noted)

PARAMETER

TEST CONDITION

MIN

NOM

MAX

UNIT

Supply voltage

VC2, PBI

2.2

26

V

Shutdown voltage

1.8

2.0

2.2

V

Start-up voltage

2.05

2.25

2.45

V

Shutdown voltage

hysteresis

250

mV

Input voltage range

SDA, SCL

5.5

V

TS1

SRP, SRN

–0.2

0.2

VC2

VC1

PACK

26

Output voltage range

CHG, DSG

26

V

External PBI capacitor

2.2

µF

Operating temperature

–40

85

°C