Microchip Technology Inc.

DSC2311KL2-R0052

6

4

4

4

5

Parameter

Symbol

Condition

Min.

Typ.

Max.

Units

Supply Voltage¹

VDD

2.25

3.6

V

Supply Current²

IDD

OE pin low - outputs are disabled

21

23

mA

Frequency Stability

F

Includes frequency variation due to initial

tolerance, temp. and power supply voltage

±25

ppm

Aging

F

First year (@ 25°C)

±5

ppm

Startup Time³

tSU

T = 25°C

5

ms

Input Logic High

Input Logic Low

VIH

VIL

0.75 x VDD

-

-

0.25 x VDD

V

Output Disable Time

tDA

5

ns

Output Enable Time

tEN

20

ns

Pull-Up Resistor²

Pull-up exists on pin 1

40

kOhms

Output Logic High

Output Logic Low

VOH

VOL

I = ±6mA

0.9 x VDD

-

-

0.1 x VDD

V

Output Transition Time

Rise Time

Fall Time

tR

tF

20% to 80%

CL = 15pF

1.1

1.43

2

2

ns

Frequency

F0

F1

CLK0

CLK1

4

24

MHz

Output Duty Cycle

SYM

45

55

%

Period Jitter

JPER

CLK0 = CLK1 = 25MHz

3

psRMS

Integrated Phase Noise

JCC

200kHz to 20MHz @ 25MHz

100kHz to 20MHz @ 25MHz

12kHz to 20MHz @ 25MHz

0.3

0.38

1.7

2

psRMS

Notes:

1. Pin 4 VDD should be filtered with 0.1uF capacitor.

2. Output is enabled if OE pad is high or not connected. Supply current = Disabled Current +

IDD from CLK0 +

IDD from CLK1. See Current

Consumption graph on next page.

3. tSU is time to stable output frequency after VDD is applied and outputs are enabled.

4. See Figure 3 for detail (all based on maximum drive settings).

5. Period Jitter includes crosstalk from adjacent output.

6. For other ppm stabilities, contact the factory at MEMS_Support@microchip.com.

Absolute Maximum Ratings

Item

Min.

Max.

Units

Condition

Supply Voltage

-0.3

+4.0

V

Input Voltage

-0.3

VDD + 0.3

V

Junction Temp

-

+150

°C

Storage Temp

-55

+150

°C

Soldering Temp

-

+260

°C

40sec max.

ESD

HBM

MM

CDM

-

4000

400

1500

V

August 09, 2016

3

Revision 1.0

tcghelp@microchip.com

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