STWLC33

Package information

DocID030310 Rev 1

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Table 2: CSP (3.97x2.67 mm) package mechanical data

Dim.

mm

Min.

Typ.

Max.

A

0.545

0.600

0.655

A1

0.170

0.200

0.230

A2

0.350

0.375

0.400

b

0.230

0.260

0.290

D

3.910

3.940

3.970

D1

3.20

E

2.610

2.640

2.670

E1

2.00

e

0.40

SE

0.20

fD

0.370

fE

0.320

$

0.025

ccc

0.060

The terminal A1 on the bump side is identified by a distinguishing feature (for

instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing

bump. The terminal A1 on the backside of the product is identified by a

distinguishing feature (for instance by a circular "clear area", typically between 0.1

and 0.5 mm diameter, depending on the die size).

Figure 2: CSP (3.97x2.67 mm) recommended footprint

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