ADG936/ADG936-R

Rev. 0 | Page 13 of 16

OUTLINE DIMENSIONS

20

1

11

10

6.40 BSC

4.50

4.40

4.30

PIN 1

6.60

6.50

6.40

SEATING

PLANE

0.15

0.05

0.30

0.19

0.65

BSC

1.20 MAX

0.20

0.09

0.75

0.60

0.45

8°

0°

COMPLIANT TO JEDEC STANDARDS MO-153AC

COPLANARITY

0.10

Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-20)

Dimensions shown in millimeters

1

20

5

6

11

16

15

10

2.25

2.10 SQ

1.95

0.75

0.55

0.35

0.30

0.23

0.18

0.50

BSC

12° MAX

0.20

REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BCS SQ

4.00

BSC SQ

COPLANARITY

0.08

0.60

MAX

0.60

MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1

Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body

(CP-20-1)

Dimensions shown in millimeters