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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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HA5352IP 数据表(PDF) 5 Page - Intersil Corporation |
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HA5352IP 数据表(HTML) 5 Page - Intersil Corporation |
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5 / 5 page  3-5 HA5352 Die Characteristics DIE DIMENSIONS: 2530 x 3110 x 525 ±25.4µm 100 x 122 x 19 ±1mil METALLIZATION: Type: Metal 1: AlSiCu/TiW Thickness: Metal 1: 6k Å ± 750Å Type: Metal 2: AlSiCu Thickness: Metal 2: 16k Å ± 1.1kÅ GLASSIVATION: Type: Sandwich Passivation Nitride - 4k Å, Undoped Si Glass(USG) - 8kÅ, Total - 12kÅ ±2kÅ SUBSTRATE POTENTIAL: V- TRANSISTOR COUNT: 312 Metallization Mask Layout HA5352 -IN1 GND1 GND1 V1+ V1+ V1+ S/H CONTROL1 VOUT1 VOUT1 V2- V2- V2- VOUT2 VOUT2 S/H CONTROL2 V2+ V2+ V2+ GND2 GND2 -IN2 +IN2 V1- V1- V1- +IN1 |
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