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TS472 数据表(PDF) 19 Page - STMicroelectronics |
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TS472 数据表(HTML) 19 Page - STMicroelectronics |
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19 / 20 page ![]() TS472 Package Mechanical Data 19/20 Figure 44. Flip-chip - 12 bumps Figure 45. Tape & reel specification (top view) ■ Die size: 2.1mm x 1.6mm ± 30µm ■ Die height (including bumps): 600µm ■ Bumps diameter: 315µm ±50µm ■ Bump Diameter Before Reflow: 300µm ±10µm ■ Bumps Height: 250µm ±40µm ■ Die Height: 350µm ±20µm ■ Pitch: 500µm ±50µm ■ Coplanarity: 50µm max 2.1 mm 1.6 mm 0.5mm 0.5mm ∅0.315mm 2.1 mm 1.6 mm 0.5mm 0.5mm ∅0.315mm 6 0 0 µ m 6 0 0 µ m User direction of feed 8 Die size X + 70µm 4 1.5 4 All dimensions are in mm A 1 A 1 User direction of feed 8 Die size X + 70µm 4 1.5 4 All dimensions are in mm A 1 A 1 |
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