CDCVF857

2.5V PHASELOCK LOOP CLOCK DRIVER

SCAS047D − MARCH 2003 − REVISED JUNE 2005

13

POST OFFICE BOX 655303

THERMAL INFORMATION

This package incorporates an exposed thermal pad that is designed to be attached directly to an external

heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB), the PCB can be used

as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to a ground

plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer from the

integrated circuit (IC).

For information on the Quad Flatpack No-Lead (QFN) package and its advantages, refer to Application Report,

Quad Flatpack No-Lead Packages, Texas Instruments Literature No. SCBA017. This document is available at

www.ti.com.

The exposed thermal pad dimensions for this package are shown in the following illustration.