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FMS2002 数据表(PDF) 3 Page - Filtronic Compound Semiconductors |
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FMS2002 数据表(HTML) 3 Page - Filtronic Compound Semiconductors |
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3 / 4 page ![]() Preliminary Data Sheet 1.0 subject to change without notice miconductors Ltd, Heighington Lane Business Park, Newton Aycliffe, Co Durham. DL5 6JW +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com Website: www.filcs.com Filtronic Compound Se . Contact Details: Tel: FMS2002 ES1 SP3T Bonding Configuration Pad Number Port Symbol Connection on Board* 1 RF input port 1 RF 1 RF1 2 RF input port 2 RF 2 RF3 3 DC Control line 2 Vctrl 2 V3 4 RF input port 3 RF 3 RF2 5 DC Control line 1 Vctrl 1 V1 6 Antenna ANT ANT 7 DC Control line 3 Vctrl 3 V2 * RF4, RF 5, V4 and V5 lines are unused. Bonding Pad Layout 0.00 mm 97 µm (x) 792 µm (y) SP3T F1 5 6 593 µm (x) 97 µm (x) 319 µm (y) 792 µm (y) 554.75 µm (y) 48.5 µm (y) 593 µm (x) 2 1 3 7 4 48.5 µm (y) 551.5 µm (y) 97 µm (x) 792 µm (y) SP3T F1 SP3T F1 5 6 593 µm (x) 97 µm (x) 319 µm (y) 792 µm (y) 554.75 µm (y) 48.5 µm (y) 593 µm (x) 2 1 3 2 1 3 7 4 48.5 µm (y) 551.5 µm (y) Preliminary specifications |
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