Advanced Product Information

1.1

2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2006

Truth Table:

ANT-RF1

ANT-RF2

High

Low

On

Off

Low

High

Off

On

Note:

‘High’

= +2.4V to +3.3V

‘Low’

= 0V to +0.2V

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size

( µm x µm )

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

Opening (

µm xµm )

750 x 510

150

152

72 x 72

Pad

Reference

Description

Pin Coordinates

(µm)

ANT

Antenna

375,412

RF1

Receive

108,260

RF2

Transmit

641,260

VC1

Vctrl1 (ANT to RF1 Control)

108,412

VC2

Vctrl2 (ANT to RF2 Control)

641,412

GND1

Ground

108,108

GND2

Ground

641,108

VC1

RF1

GND1

VC2

RF2

GND2

ANT