3

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2007

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm)

897x929

150

127

80x80

Pad Number

Pad Name

Description

Pin Coordinates

(x

µm, y µm)

A

GND

Ground

(142.1 , 709.0)

B

ANT1

Antenna 1

(142.1 , 581.6)

C

GND

Ground

(142.1 , 448.5)

D

ANT2

Antenna 2

(142.1 ,327.9)

E

GND

Ground

(142.1 , 201.4)

F

V1

RX-Ant1

(349.8 , 88.5)

G

V3

TX-Ant2

(522.2 , 88.5)

H

GND

Ground

(769.2 , 201.4)

I

RX

Receive

(769.2 , 327.9)

J

GND

Ground

(769.2 , 448.5)

K

TX

Transmit

(769.2 , 581.6)

L

GND

Ground

(769.2 , 709.0)

M

V2

RX-Ant2

(522.2 , 807.7)

N

V4

Tx-Ant1

(349.8 , 807.7)

A

B

C

D

E

F

G

H

I

J

K

L

M

N