2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2020

Truth Table:

V1

V2

PATH (ON)

High

Low

RF1-ANT

Low

High

RF2-ANT

Note:

‘High’ = +2.5V to +5V

‘Low’

= 0V to 0.2V

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size (

µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm)

930 x 1020(engineering mask)

100

166

70 x 70

Pad

Pad

Name

Description

Pin Coordinates

(µm)

A

ANT

Antenna

732, 510

B

RF1

RF1 Output

270, 920

C

RF2

RF2 Output

280, 101

D

V1

RF1 Control Voltage

731, 918

E

V2

RF2 Control Voltage

734, 98

F

GND T1

Ground 1

186, 885

G

GND T2

Ground 2

186, 420

A

B

G

F

E

D

C