Advanced Product Information

1.1

2

Preliminary specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com

Contact Details (USA): Tel: +1 (408) 850 5790

Fax: +1 (408) 850 5766

Website: www.filcs.com

FMS2021

Truth Table:

State

Vctrl1

Vctrl2

Vctrl3

Vctrl4

ON PATH(S)

1

HIGH

LOW

LOW

LOW

ANT1-RX

2

LOW

HIGH

LOW

LOW

ANT2-RX

3

LOW

LOW

HIGH

LOW

ANT2-TX

4

LOW

LOW

LOW

HIGH

ANT1-TX

5

LOW

HIGH

LOW

HIGH

ANT1-TX and ANT2-RX

6

HIGH

LOW

HIGH

LOW

ANT1-RX and ANT2-TX

Note:

‘High’

= +2.4V to +3.3V

‘Low’

= 0V to +0.2V

Pad and Die Layout:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the

bond pad opening

Die Size

(µm x µm)

Die Thickness (

µm)

Min. Bond Pad

Pitch(

µm)

Min. Bond pad

opening (

µm x µm)

660 x 680

150

129

80 x 80

Pad

Name

Description

Pin Coordinates

(x

µm, y µm)

V4

Vctrl4

134 , 568

ANT1

Antenna 1

134 , 439

ANT2

Antenna 2

134 , 257

V1

Vcrtl1

134 , 114

GND2

Ground 2

355.5 , 114

V3

Vctrl3

547 , 114

RX

Receive

547 , 257

TX

Transmit

547 , 439

V2

Vctrl2

547 , 568

GND1

Ground 1

353 , 568

V4

ANT1

ANT2

V1

V2

TX

RX

V3

GND1

GND2