CAUTION
SSSS Hand assembly
If PC boards are assembled by hand, care must be taken
to avoid mechanical damage. We recommend:
- Use tweezers, the components should be gripped
across the two terminals, A.
- Avoid any contact with the cut surface, C.
- The usage of a pen under vacuum on the surface B
is recommended.
A
B
C
A
C
B
A = Termination surface
B = External surface
C=Cut surface
Fig. 1
SSSS Soldering iron
In case of hand soldering the following recommandations
must be taken:
- Maximum temperature:
250_C on the soldering
iron.
- Soldering time:
5 s max.
- Avoid contact between the iron soldering and chip.
SSSS Soldering and flux recommendation
- Solder:
SnPb solder paste
- Flux:
no-clean flux.
SSSS Cleaning
To clean flux from the PC board assembly, use a suitable
solvent such as Isopropylalcohol.
Solvents such as Toluene, Xylene and Trichloroethylene
should be avoided.
CORRECTIVE ACTIONS TABLE (problems after soldering process)
TYPE OF DEFECT
CAUSE
POSSIBLE SOLUTION / ACTION
- wrong landing area
- see page 11 /end user
- quality of solder paste
- see page 11 /end user
No solder joint in one end termination
- thermal profile
- see page 11 /end user
No solder joint in one end termination
- bad temperature distribution into the
reflow oven
- decrease time of preheating or
change the orientation of P.C.B.
board/end user.
- too high temperature
- apply suggested thermal profile
(page 11) / end user
Mechanical deformation of the body
- too long time
- apply suggested thermal profile
(page 11) / end user
- moisture inside capacitor
- see use suggestion
(page 11) / end user
Short circuit
- mechanical damage
- take care to hand assembly
(page 12) / end user
Do not hesitate to contact our Technical Service for any doubt or more detailed information.
LDE Series
PEN -- PET H.T.
12
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