LP6490-01

Jun.-2017

www.lowpowersemi.com

Page 3 of 6

Preliminary Datasheet

LP6490

Absolute Maximum Ratings

Note 1



VIN to GND ------------------------------------------------------------------------------------------------------- -0.3V to 36V



SW to GND -------------------------------------------------------------------------------------------------- -0.3V to 36+0.3V



All other pin to GND ---------------------------------------------------------------------------------------------- -0.3V to 6V



Maximum Operating Junction temperature-------------------------------------------------------------------------- 150℃



Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------- 260°C



Storage Temperature -------------------------------------------------------------------------------------- -55℃ to 150°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Thermal Information





ESD Susceptibility



HBM(Human Body Mode) ----------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) ------------------------------------------------------------------------------------------------------ 200V

Recommended Operating Conditions



Operating Junction Temperature Range (TJ) ------------------------------------------------------- -40℃ to 150℃



Ambient Temperature Range ------------------------------------------------------------------------------ -40℃ to 85℃