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LP1130 数据表(PDF) 3 Page - Lowpower Semiconductor inc |
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LP1130 数据表(HTML) 3 Page - Lowpower Semiconductor inc |
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3 / 5 page ![]() LP1130-01 Apr.-2018 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 3 of 5 Preliminary Datasheet LP1130 Function Diagram OTP UVLO LOGIC Anti-Cross Conduction VCC PWM EN BST SWN PGND VCC VIN Absolute Maximum Ratings VCC ----------------------------------------------------------------------------------------------------------------- -0.3V to 15V VIN ------------------------------------------------------------------------------------------------------------------- -0.3V to 30V BST --------------------------------------------------------------------------------------------------------------- -0.3V to 35V BST to SWN ------------------------------------------------------------------------------------------------------ -0.3V to 15V SWN ------------------------------------------------------------------------------------------------------------------- -5V to 20V EN,PWM ---------------------------------------------------------------------------------------------------------- -0.3V to 6.5V Maximum Junction Temperature ------------------------------------------------------------------------------------ 160℃ Maximum Soldering Temperature (at leads,10 sec) ----------------------------------------------------------- 260℃ Storage Temperature --------------------------------------------------------------------------------------- -55℃ to 165℃ Operating Ambient Temperature Range -------------------------------------------------------------- -40℃ to 85℃ Note1:All voltages are with respect to PGND except where noted. Note2:Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note3: This device is ESD sensitive. Use standard ESD precautions when handling. Thermal Information Package Thermal Resistance (Note4) Maximum Power Dissipation (PD,TA=25℃) ------------------------------------------------------------------------ 1.5W Junction to Ambient, θJA----------------------------------------------------------------------------------------------- 80℃/W Note4:2 layer board, 1 in2 Cu, 1 oz thickness. |
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