LP6221A

Feb.-2019

www.lowpowersemi.com

Page 4 of 7

Preliminary Datasheet

LP6221A



VIN to GND ----------------------------------------------------------------------------------------------------------- -0.3V to 16V



SW to GND ----------------------------------------------------------------------------------------------------------- -0.3V to 24V



OC/FB to GND --------------------------------------------------------------------------------------------------------- -0.3V to 6V



Other Pin to GND ---------------------------------------------------------------------------------------------------- -0.3V to 15V



Maximum Junction Temperature ----------------------------------------------------------------------------------------- 150°C





Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------------- 260°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information





ESD Susceptibility



HBM(Human Body Mode) ---------------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) ---------------------------------------------------------------------------------------------------------- 200V