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LP6261 数据表(PDF) 3 Page - Lowpower Semiconductor inc |
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LP6261 数据表(HTML) 3 Page - Lowpower Semiconductor inc |
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3 / 7 page ![]() LP6261-02 Dec.-2019 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 3 of 7 Preliminary Datasheet LP6261 Absolute Maximum Ratings Note 1 VIN and EN to GND ----------------------------------------------------------------------------------------------------------- 6.5V VOUT to GND --------------------------------------------------------------------------------------------------------------------- 8V SW to GND ----------------------------------------------------------------------------------------------------------------------- 10V Maximum Junction Temperature ----------------------------------------------------------------------------------------- 150°C Operating Ambient Temperature Range (TA) --------------------------------------------------------------- -40℃ to 85°C Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------------- 260°C Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Information Maximum Power Dissipation (SOT23-6, PD,TA=25℃) ------------------------------------------------------------- 0.45W Thermal Resistance (SOT23-6, JA) --------------------------------------------------------------------------------- 250℃/W ESD Susceptibility HBM(Human Body Mode) ---------------------------------------------------------------------------------------------------- 2KV MM(Machine Mode) ---------------------------------------------------------------------------------------------------------- 200V |
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