MCP2561FD-ESLASHMF datasheet(17/32 Pages) MICROCHIP

17 / 32 page

 2014 Microchip Technology Inc.

DS20005284A-page 17

MCP2561/2FD

3.0

PACKAGING INFORMATION

3.1

Package Marking Information

8-Lead PDIP (300 mil)

Example:

8-Lead SOIC (150 mil)

Example:

Legend: XX...X

Customer-specific information



Year code (last digit of calendar year)



Year code (last 2 digits of calendar year)



Week code (week of January 1 is week ‘01’)



NNN

Alphanumeric traceability code



Pb-free JEDEC designator for Matte Tin (Sn)



This package is Pb-free. The Pb-free JEDEC designator ( )



can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Example:

8-Lead DFN (3x3 mm)

8-Lead PDIP (300 mil)

Example:

XXXXXXXX

XXXXXNNN

YYWW

2561FD

E/P ^^256

1307

Part Number

Code

MCP2561FD-E/MF

DADY

MCP2561FDT-E/MF

DADY

MCP2561FD-H/MF

DADZ

MCP2561FDT-H/MF

DADZ

MCP2562FD-E/MF

DAEA

MCP2562FDT-E/MF

DAEA

MCP2562FD-H/MF

DAEB

MCP2562FDT-H/MF

DAEB

DADY

1307

256

NNN

2561FDE

SN ^^1246

256

2561FDH

SN ^^1246

256

2561FD

H/P ^^256

1307

MCP2561FD-E/MF 数据表(PDF) 17 Page - Microchip Technology

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