IS25LP032D-RHLA3:P datasheet(117/118 Pages) ISSI

部件名	IS25LP032D-RHLA3:P

功能描述	SERIAL FLASH MEMORY WITH 133MHZ MULTI I/O SPI & QUAD I/O QPI DTR INTERFACE

PDF	118 Pages

Scroll/Zoom	100%

制造商	ISSI [Integrated Silicon Solution, Inc]

网页	http://www.issi.com

标志

117 / 118 page

IS25LP032D

IS25WP032D

Integrated Silicon Solution, Inc.- www.issi.com

117

Rev. A12

08/04/2020

11. ORDERING INFORMATION - Valid Part Numbers

IS25LP 032 D

E :P

PBO (Polybenzoxazole) LAYER

:P = Die Overcoat process-PBO layer (Call Factory)

Blank = Without Die Overcoat process-PBO layer

TEMPERATURE RANGE

E = Extended (-40°C to +105°C)

A3 = Automotive Grade (-40°C to +125°C)

PACKAGING CONTENT

L = RoHS compliant

PACKAGE Type (1)

B = 8-pin SOIC 208mil

N = 8-pin SOIC 150mil

T = 8-contact USON 4x3mm

E = 8-contact XSON 4x4mm

K = 8-contact WSON 6x5mm

L = 8-contact WSON 8x6mm (Call Factory)

M = 16-pin SOIC 300mil

G = 24-ball TFBGA (6x8mm) 4x6 ball array (Call Factory)

H = 24-ball TFBGA (6x8mm) 5x5 ball array (Call Factory)

W = KGD (Call Factory)

Option

J = Standard

R = Dedicated RESET# pin for 16-pin SOIC/24-ball TFBGA

Q = QE bit set to 1 (Call Factory)

Die Revision

D = Revision D

Density

032 = 32 Megabit

BASE PART NUMBER

IS = Integrated Silicon Solution Inc.

25LP = FLASH, 2.30V ~ 3.60V, QPI

25WP = FLASH, 1.65V ~ 1.95V, QPI

Note:

1. Call Factory for other package options available

IS25LP032D-RHLA3:P 数据表(PDF) 117 Page - Integrated Silicon Solution, Inc

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