PACKAGE OPTION ADDENDUM

www.ti.com

26-Aug-2020

Addendum-Page 2

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

TLC3702IP

ACTIVE

PDIP

P

8

50

Green (RoHS

& no Sb/Br)

NIPDAU

N / A for Pkg Type

-40 to 85

TLC3702IP

TLC3702IPE4

ACTIVE

PDIP

P

8

50

Green (RoHS

& no Sb/Br)

NIPDAU

N / A for Pkg Type

-40 to 85

TLC3702IP

TLC3702IPW

ACTIVE

TSSOP

PW

8

150

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-40 to 85

P3702I

TLC3702IPWR

ACTIVE

TSSOP

PW

8

2000

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-40 to 85

P3702I

TLC3702IPWRG4

ACTIVE

TSSOP

PW

8

2000

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-40 to 85

P3702I

TLC3702MD

ACTIVE

SOIC

D

8

75

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-55 to 125

3702M

TLC3702MDG4

ACTIVE

SOIC

D

8

75

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-55 to 125

3702M

TLC3702MDR

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-55 to 125

3702M

TLC3702MDRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

NIPDAU

Level-1-260C-UNLIM

-55 to 125

3702M

TLC3702MFKB

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

9153201Q2A

TLC3702

MFKB

TLC3702MJG

ACTIVE

CDIP

JG

8

1

TBD

SNPB

N / A for Pkg Type

-55 to 125

TLC3702MJG

TLC3702MJGB

ACTIVE

CDIP

JG

8

1

TBD

SNPB

N / A for Pkg Type

-55 to 125

9153201QPA

TLC3702M

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".