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TPS22976NDPUT 数据表(PDF) 3 Page - Texas Instruments |
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TPS22976NDPUT 数据表(HTML) 3 Page - Texas Instruments |
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3 / 32 page ![]() 14 1 VOUT2 VOUT1 GND CT1 CT2 VOUT2 VOUT1 VIN1 VIN1 VBIAS VIN2 VIN2 ON1 ON2 1 VIN1 VIN1 ON1 VBIAS VIN2 VIN2 ON2 VOUT2 VOUT1 CT1 GND CT2 VOUT2 VOUT1 2 3 4 5 6 14 13 12 10 9 Thermal Pad 6 7 8 11 3 TPS22976 www.ti.com SLVSDE7B – NOVEMBER 2016 – REVISED SEPTEMBER 2017 Product Folder Links: TPS22976 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated 5 Device Comparison Table DEVICE RON AT VIN = VBIAS = 5 V (TYPICAL) QUICK OUTPUT DISCHARGE MAXIMUM OUTPUT CURRENT ENABLE TPS22976 14 mΩ Yes 6 A Active high TPS22976N 14 mΩ No 6 A Active high 6 Pin Configuration and Functions DPU Package 14-Pin WSON with Exposed Thermal Pad Top View DPU Package 14-Pin WSON with Exposed Thermal Pad Bottom View Pin Functions PIN I/O DESCRIPTION NO. NAME 1 VIN1 I Switch 1 input. Recommended voltage range for these pins for optimal RON performance is 0.6 V to VBIAS. Place an optional decoupling capacitor between these pins and GND to reduce VIN1 dip during turnon of the channel. See the Application Information section for more information 2 3 ON1 I Active-high switch 1 control input. Do not leave floating 4 VBIAS I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.7 V. See the Application Information section 5 ON2 I Active-high switch 2 control input. Do not leave floating 6 VIN2 I Switch 2 input. Recommended voltage range for these pins for optimal RON performance is 0.6 V to VBIAS. Place an optional decoupling capacitor between these pins and GND to reduce VIN2 dip during turnon of the channel. See the Application Information section for more information 7 8 VOUT2 O Switch 2 output 9 10 CT2 O Switch 2 slew rate control. Can be left floating. Capacitor used on this pin must be rated for a minimum of 25 V for desired rise time performance 11 GND — Ground 12 CT1 O Switch 1 slew rate control. Can be left floating. Capacitor used on this pin must be rated for a minimum of 25 V for desired rise time performance 13 VOUT1 O Switch 1 output 14 — Thermal pad — Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See the Layout section for layout guidelines |
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