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Document Number: 28300

2

Revision: 22-Sep-03

085 CS

Vishay BCcomponents

Aluminum Capacitors

SMD (Chip) Standard

DIMENSIONS in millimeters

7.5

9 max

2.7

max

2 max

3.9

max

4.1

max

2 max

3.9

max

2.7

max

Fig.2 Dimensional outlines.

a. Case size 8.8 × 3.7 × 3.9 mm.

10.8

12.2 max

2.7

max

2 max

3.9

max

4.1

max

2 max

3.9

max

2.7

max

a.

b.

b. Case size 11.9 x 3.7 x 3.9 mm.

PACKAGING

Tape on reel packaging: 2000 per reel.

Detailed tape dimensions see section ‘PACKAGING’.

MOUNTING

The capacitors are designed for automatic placement on

printed-circuit boards or hybrid circuits.

Optimum dimensions of soldering pads depend upon

soldering method, mounting accuracy, print lay-out and/or

adjacent components.

For recommended pad dimensions, refer to Fig. 3

and Table 2.

Table 2

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ±0.25mm)

NOMINAL CASE SIZE

L ×

×

×

× W ×

×

×

× H

FOR REFLOW SOLDERING

FOR WAVE SOLDERING

ABCD

E

F

G

ABCD

E

F

G

8.8 × 3.7 × 3.9

9.7

3.5

2.9

2.5

3.0

10.1

4.4

13.5

4.1

4.7

3.7

2.9

14.0

8.4

11.9 × 3.7 × 3.9

12.9

6.5

2.9

2.5

6.0

13.3

4.4

16.8

7.4

4.7

3.7

6.1

17.3

8.4

solder land/

solder paste

pattern

solder resist

pattern

occupied

area

tracks or

dummy tracks

E

D

G

C

B

A

F

E

D

G

C

B

A

F

reflow soldering

wave soldering

Fig.3 Recommended pad dimensions for reflow and wave soldering.