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V•I Chip Bus Converter Module

B048K030T21

Rev. 1.0

Page 1 of 15

V•I Chip Bus Converter Module

PRELIMINARY

Parameter

Values

Unit

Notes

+In to -In

-1.0 to 60

Vdc

+In to -In

100

Vdc

For 100 ms

PC to -In

-0.3 to 7.0

Vdc

+Out to -Out

-0.5 to 6.0

Vdc

Isolation voltage

2,250

Vdc

Input to Output

Output current

70

A

Continuous

Peak output current

105

A

For 1 ms

Output power

210

W

Continuous

Peak output power

315

W

For 1 ms

Case temperature

208

°C

During reflow

-40 to 125

°C

T - Grade

-55 to 125

°C

M - Grade

Storage temperature

-40 to 150

°C

T - Grade

-65 to 150

°C

M - Grade

•48V to 3 V V•I Chip Converter

• 210 Watt (315 Watt for 1 ms)

• Low weight – 0.5 oz (14 g)

• ZVS/ZCS isolated sine

amplitude converter

•94% efficiency

• 125°C operation

• <1 µs transient response

• 3.5 million hours MTBF

•No output filtering required

• Surface mount BGA or J-Lead

packages

B048K030T21

Vin = 38 - 55 V

Vout = 2.38 - 3.43 V

Iout = 70 A

K = 1/16

Rout = 2.0 m

Ω max

Actual size

©

Bus Converter Module

BCM

Output Power

Designator

B

048

K

030

T

21

Bus Converter

Module

Input Voltage

Designator

Product Grade Temperatures (°C)

Grade

Storage

Operating

T-40 to150 -40 to125

M-65 to150 -55 to125

Configuration Options

F= Onboard (Figure 20)

K= Inboard (Figure 19)

Output Voltage

Designator

Part Numbering

Note:

(1) The referenced junction is defined as the semiconductor having the highest temperature.

This temperature is monitored by a shutdown comparator.

K indicates BGA configuration. For other

mounting options see Part Numbering below.

Product Description

The V•I Chip Bus Converter Module (BCM) is a high

efficiency (>94%), narrow input range Sine Amplitude

Converter (SAC) operating from a 38 to 55 Vdc primary

bus to deliver an isolated 2.38 V to 3.43 V secondary.

The BCM may be used to power non-isolated POL

converters or as an independent 2.38 – 3.43 V source.

Due to the fast response time and low noise of the

BCM, the need for limited life aluminum electrolytic or

tantalum capacitors at the input of POL converters is

reduced—or eliminated—resulting in savings of board

area, materials and total system cost.

may be surface mounted with a profile as low as 0.16"

(4 mm) over the PCB. Its V•I Chip power package is

compatible with onboard or inboard surface mounting.

The V•I Chip package provides flexible thermal

management through its low Junction-to-Case and

Junction-to-BGA thermal resistance. Owing to its high

conversion efficiency and safe operating temperature

range, the BCM does not require a discrete heat sink in

typical applications. It is also available with heat sink

options, assuring low junction temperatures and long

life in the harshest environments.

Absolute Maximum Ratings