ADL6012

Data Sheet

Rev. 0 | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VPOS to OCOM, RFCM)

5.5 V

Average

20 dBm

Peak

23 dBm

−0.3 V to VPOS + 0.3 V

Case Operating Temperature Range

ADL6012ACPZN

−40°C to +105°C

ADL6012SCPZN

−55°C to +125°C

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

1

Guaranteed by design. Not production tested.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

junction to case (exposed pad) thermal impedance.

Table 3. Thermal Resistance

Unit

CP-10-12

74.69

11.64

°C/W

1

Thermal impedance simulated value is based on no airflow with the exposed

pad soldered to a 4-layer JEDEC board.

2

underside of the package.

ESD CAUTION