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MGC3140 数据表(PDF) 24 Page - Microchip Technology

部件名 MGC3140
功能描述  MGC3140 3D Tracking and Gesture Controller Data Sheet
PDF  49 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

MGC3140 数据表(HTML) 24 Page - Microchip Technology

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1.
These are typical operating voltages.
2.
It is important that the low-ESR capacitor is placed as close as possible to the VCAP pin.
3.
The typical voltage on the VCAP is 1.8V.
6.2.2
Decoupling Capacitors
The use of decoupling capacitors on power supply pins, such as VDD, VSS, and AVDD is required.
Consider the following criteria when using decoupling capacitors:
Value and type of capacitor: A value of 0.1 μF (100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance (low-ESR) capacitor and have resonance frequency
in the range of 20 MHz and higher. It is further recommended that ceramic capacitors be used.
Placement on the printed circuit board: The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the capacitors be placed on the same side of the
board as the device. If space is constricted, the capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace length from the pin to the capacitor is within 6 mm
in length.
Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens
of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling
capacitor. The value of the second capacitor can be in the range of 0.01 μF to 0.001 μF. Place this
second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as close to the power and ground pins as possible. For
example, 0.1 μF in parallel with 0.001 μF.
Maximizing performance: On the board layout from the power supply circuit, run the power and
return traces to the decoupling capacitors first, and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain. Equally important is to keep the trace length
between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance.
Related Links
8.5 Reference Schematic
6.3
Clocks
The MGC3140 is embedding two internal oscillators, high speed and low speed. The High-Speed
Oscillator (HSO) is factory-trimmed, achieving high accuracy.
High-Speed Oscillator (HSO): The MGC3140 is clocked by an internal HSO running at 40 MHz
(+/- 2%). This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the
SPU. During Deep Sleep mode, the HSO clock is switched off.
Low-Speed Oscillator (LSO): This low-speed and ultra-low-power oscillator is typically 32 kHz (+/-
15%). It is used during power-saving modes.
6.4
Operation Modes
MGC3140 offers three operation modes that allow the user to balance power consumption with device
functionality. In all of the modes described in this section, power saving is configured by GestIC Library
messages. A summary of the operation modes, as well as their respective current consumption values
are given in the table below:
MGC3140
Functional Description
© 2018 Microchip Technology Inc.
DS40002037A-page 24



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