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MGC3140 数据表(PDF) 24 Page - Microchip Technology |
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MGC3140 数据表(HTML) 24 Page - Microchip Technology |
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24 / 49 page ![]() 1. These are typical operating voltages. 2. It is important that the low-ESR capacitor is placed as close as possible to the VCAP pin. 3. The typical voltage on the VCAP is 1.8V. 6.2.2 Decoupling Capacitors The use of decoupling capacitors on power supply pins, such as VDD, VSS, and AVDD is required. Consider the following criteria when using decoupling capacitors: • Value and type of capacitor: A value of 0.1 μF (100 nF), 10-20V is recommended. The capacitor should be a low Equivalent Series Resistance (low-ESR) capacitor and have resonance frequency in the range of 20 MHz and higher. It is further recommended that ceramic capacitors be used. • Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended that the capacitors be placed on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is within 6 mm in length. • Handling high-frequency noise: If the board is experiencing high-frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 μF to 0.001 μF. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible. For example, 0.1 μF in parallel with 0.001 μF. • Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance. Related Links 8.5 Reference Schematic 6.3 Clocks The MGC3140 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy. • High-Speed Oscillator (HSO): The MGC3140 is clocked by an internal HSO running at 40 MHz (+/- 2%). This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the SPU. During Deep Sleep mode, the HSO clock is switched off. • Low-Speed Oscillator (LSO): This low-speed and ultra-low-power oscillator is typically 32 kHz (+/- 15%). It is used during power-saving modes. 6.4 Operation Modes MGC3140 offers three operation modes that allow the user to balance power consumption with device functionality. In all of the modes described in this section, power saving is configured by GestIC Library messages. A summary of the operation modes, as well as their respective current consumption values are given in the table below: MGC3140 Functional Description © 2018 Microchip Technology Inc. DS40002037A-page 24 |
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