9

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

9.1

Soldering information

The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for

soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

RAMP-DOWN

RAMP-UP

ts

PREHEAT

t

L

30 60 90 120 150 180

210 240

270 300

330 360 390

T25° to PEAK

CRITICAL ZONE

TIME

Description

Parameter

Pb free

Average ramp rate

3 °C/sec max

Preheat

Minimum temperature

150 °C

Maximum temperature

200 °C

60 sec to 120 sec

Ramp-up rate

Time maintained above liquidus temperature

Liquidus temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

IMP34DT05

Package information

DS12725 - Rev 3

page 13/20