7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

non-V devices

2

30

V

V devices

2

32

"B" version devices

3

36

non-B devices

0

(V+) – 2.0

V

"B" version devices

–0.1

LM193

–55

125

°C

LM2903, LM2903V, LM2903AV, LM2903B

–40

125

LM393B

–40

85

LM293, LM293A

–25

85

LM393, LM393A

0

70

7.4 Thermal Information: LM193

THERMAL METRIC(1)

LM193

UNIT

D

(SOIC)

8 pin

Junction-to-ambient thermal resistance

126.4

°C/W

Junction-to-case (top) thermal resistance

70

°C/W

Junction-to-board thermal resistance

64.9

°C/W

Junction-to-top characterization parameter

20.3

°C/W

Junction-to-board characterization parameter

64.5

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes)

THERMAL METRIC(1)

LM293, LM393, LM2903

UNIT

D

(SOIC)

DGK

(VSSOP)

P

(PDIP)

PS

(SO)

PW

(TSSOP)

8 pin

8 pin

8 pin

8 pin

8 pin

Junction-to-ambient thermal resistance

131.8

199.4

73.7

139

194.1

°C/W

78.4

90.2

62.6

98.9

77.0

°C/W

Junction-to-board thermal resistance

72.2

120.8

50.8

83.7

123.0

°C/W

Junction-to-top characterization parameter

26.5

21.5

39.2

47.4

13.1

°C/W

Junction-to-board characterization parameter

71.1

119.1

50.7

83

121.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V

SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020

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