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ADRF5042BCCZN-R7 数据表(PDF) 11 Page - Analog Devices |
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ADRF5042BCCZN-R7 数据表(HTML) 11 Page - Analog Devices |
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11 / 12 page ![]() Data Sheet ADRF5042 Rev. 0 | Page 11 of 12 APPLICATION INFORMATION EVALUATION BOARD All measurements in this data sheet are measured on the ADRF5042-EVALZ evaluation board. Figure 24 shows the simplified application circuit for ADRF5042-EVALZ evaluation board. See the ADRF5042-EVALZ user guide for more information on using the evaluation board. The design of the ADRF5042-EVALZ board serves as a layout recommendation. The Gerber files of the ADRF5042-EVALZ evaluation board are available at www.analog.com/EVAL- ADRF5042. The ADRF5042-EVALZ is a 4-layer evaluation board. The outer copper (Cu) layers are 0.5 oz (0.7 mil) plated to 1.5 oz (2.2 mil) and are separated by dielectric materials. Figure 22 shows the cross sectional view of the evaluation board stackup. 0.5oz Cu (0.7mil) RO4003 0.5oz Cu (0.7mil) 1.5oz Cu (2.2mil) 1.5oz Cu (2.2mil) W = 14mil G = 7mil T = 2.2mil H = 8mil 1.5oz Cu (2.2mil) 1.5oz Cu (2.2mil) Figure 22. Evaluation Board Stackup, Cross Sectional View All RF traces are routed on the top copper layer, whereas the inner and bottom layers are grounded planes that provide a solid ground for the RF transmission lines. The top dielectric material is 8 mil Rogers RO4003, offering optimal high frequency performance. The middle and bottom dielectric materials provide mechanical strength. The total board thickness is 62 mil, which allows 2.4 mm RF launchers to be connected at the board edges. The RF transmission lines were designed using a coplanar waveguide (CPWG) model, with a trace width of 14 mil and a ground clearance of 7 mil to have a characteristic impedance of 50 Ω. The RF transmission lines are tapered at the RFC or RFx pin transition, as shown in Figure 23. For optimal RF and thermal grounding, arrange as many plated through vias as possible around the transmission lines and under the exposed pad of the package. Figure 23. RF Trasmission Lines V1 VSS RFC 100pF 100pF 18 17 16 15 14 2 3 4 5 6 RF2 50Ω 50Ω CMOS/ LVTTL CMOS/ LVTTL CMOS/ LVTTL 50Ω –3.3V RF3 ADRF5042 TOP VIEW (Not to Scale) 1 19 13 EN 7 LS Figure 24. Application Circuit |
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